? 2003 california micro devices corp. all rights reserved. 12/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 1 CSPESD301/302/303 1,2 and 3-channel esd arrays in csp features ? 1, 2 or 3 channels of esd protection 15kv esd protection (iec 61000-4-2, contact discharge) 30kv esd protection (hbm) supports both ac and dc signal applications low leakage current (<100na) chip scale package features extremely low lead inductance for optimum esd and filter perfor- mance 4 bump, 1.06 x 0.93mm footprint chip scale pack- age (csp) lead-free version available applications i/o port protection emi filtering for data ports cellphones, notebook computers, pdas wireless handsets mp3 players digital still cameras handheld pcs product description the CSPESD301/302/303 is a family of 1, 2, and 3- channel esd protection arrays, which integrate two, three and four identical avalanche-style diodes. it is intended that one of these diodes is connected to gnd and the other diodes provide esd protection for up to 3 lines depending upon the configuration utilized. the back-to-back diode connections provide esd protec- tion for nodes that have ac signals up to 5.9v peak. these devices provide a very high level of protection for sensitive electronic components that may be sub- jected to electrostatic discharge (esd). the diodes are designed and characterized to safely dissipate esd strikes of 15kv, well beyond the maximum requirements of the iec 61000-4-2 international stan- dard. using the mil-std-883 (method 3015) specifica- tion for human body model (hbm) esd, these devices protection against contact discharges at greater than 30kv. the diodes also provide some emi filtering, when used in combination with a pcb trace or series resistor. these devices are particularly well suited for portable electronics (e.g. cellular telephones, pdas, notebook computers) because of their small package format and easy-to-use pin assignments. the cspesd 301/2/3 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing. electrical schematics b1 a2 b2 b1 a2 b2 b1 a2 a1 CSPESD301 cspesd302 cspesd303
? 2003 california micro devices corp. all rights reserved. 2 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 12/10/03 CSPESD301/302/303 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices are specified by using a " + " character for the top side orientation mark. b2 b1 a1 a2 orientation marking a1 2 1 b a n* orientation marking (see note 2) package / pinout diagrams notes: CSPESD301/302/303 top view bottom view (bumps down view) (bumps up view) * see ordering information for appropriate part marking. 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. 4-bump csp package 3) all 4 bumps are always present. unused bumps are electrically unconnected. part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 4 csp CSPESD301 f CSPESD301g f 4 csp cspesd302 g cspesd302g g 4 csp cspesd303 h cspesd303g h
? 2003 california micro devices corp. all rights reserved. 12/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 3 CSPESD301/302/303 specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to another diode, one at a time. note 3: unused pins are left open. note 4: these parameters are guaranteed by design and char- acterization. figure 1. parameter legend absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc package power rating 200 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics 1 symbol parameter conditions min typ max units v so diode stand-off voltage i diode = 10 a 5.9 v i leak diode leakage current v in =3.3v 100 na v sig small signal clamp voltage positive clamp negative clamp i diode = 10ma i diode = -10ma 6.0 -9.2 7.6 -7.6 9.2 -6.0 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 notes 2, 3 and 4 30 15 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv between adjacent bumps between diagonal bumps notes 2, 3 and 4 19.5 19.9 v v r d dynamic resistance between adjacent bumps between diagonal bumps notes 2, 3 and 4 0.85 1.10 ? ? c capacitance at 0vdc, 1mhz, 30mvac 27 pf 3.3v 10ma 10 a v sig v cl v i esd i leak slope = 1 / r d v so i
? 2003 california micro devices corp. all rights reserved. 4 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 12/10/03 CSPESD301/302/303 performance information figure 2. typical emi filter performance (0vdc, 50 ohm environment) figure 3. typical capacitance vs. input voltage (normalized to 0vdc)
? 2003 california micro devices corp. all rights reserved. 12/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 5 CSPESD301/302/303 performance information (cont?d) figure 4. low current i-v curve figure 5. high current i-v curve 2 2 4 6 8 -6 -4 -2 468 -8 -6 -4 -2 i ( a) v (v) -8 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 -12-11-10-9-8-7-6-5-4-3-2-10123456789101112 high current i-v characteristic - pads a1 to a2 current [a] voltage [v]
? 2003 california micro devices corp. all rights reserved. 6 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 12/10/03 CSPESD301/302/303 application information refer to application note ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 6. recommended non-solder mask defined pad illustration figure 7. eutectic (snpb) solder ball reflow profile figure 8. lead-free (snagcu) solder ball reflow profile printed circuit board recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds soldering maximum temperature 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2003 california micro devices corp. all rights reserved. 12/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 7 CSPESD301/302/303 mechanical details csp mechanical specifications CSPESD301/302/303 devices are packaged in a cus- tom chip scale package (csp). dimensions are shown below. for complete information on csp pack- aging, see the california micro devices csp package information document. package dimensions for CSPESD301/302/303 chip scale package csp tape and reel specifications figure 9. tape and reel mechanical data package dimensions package custom csp bumps 4 dim millimeters inches min nom max min nom max a1 0.881 0.925 0.971 0.0347 0.0365 0.0382 a2 1.015 1.060 1.105 0.0400 0.0417 0.0435 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.495 0.500 0.505 0.0195 0.0197 0.0199 c1 0.163 0.213 0.263 0.0064 0.0084 0.0104 c2 0.230 0.280 0.330 0.0091 0.0110 0.0130 d1 0.561 0.605 0.649 0.0221 0.0238 0.0255 d2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b 1 c1 b1 a1 c2 dimensions in millimeters d1 d2 a2 bottom view side view 2 b2 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CSPESD301 cspesd302 cspesd303 1.06 x 0.93 x 0.6 1.14 x 1.00 x 0.70 8mm 178mm (7") 3500 4mm 4mm top for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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